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Application
Aluminum Vapor Chamber(ALVC) Application
Liquid cooling plate(LCP) Application
Pulsating Heat Pipe (PHP) Application
3DVC Cooler Application
Copper Heat Pipes & Assemblies Application
Thermosyphon Cooler Application
Air to air or liquid Heat exchanger Application
Roll Bond Plates Application
Capability
Folded fin heat sink capability
Cold forging and pin fin heat sink capability
Die casting heat sink capability
Stacked fin capability
Zipper fin capability
Skived fin capability
Extruded heat sink capability
Friction stir welding (FSW)capability
CNC precision machining capability
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24
2026-09
NVIDIA GB200 & GB300 Liquid Cooling Kit: Production-Ready Thermal Management for AI Servers
2026-09-19
22
BESS Thermal Runaway: Why Better Cells Alone Won’t Prevent It
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Thermal Simulation: Why It Matters Before You Cut a Single Prototype
2026-09-12
15
AI Cooling: Why Thermal Management Is Becoming a Critical Challenge for AI Data Centers
10
What is PHP/OHP (Pulsating/Oscillating Heat Pipe)? Principle, Benefits and Applications
2026-09-05
08
Aluminum Vapor Chamber (ALVC): Lightweight Two-Phase Cooling for High-Power Thermal Management
03
Cold Plate Basics: What Design Factors Dominate Liquid-Cooled Cold Plate Performance for AI & Energy Storage Systems
2026-08-29
27
2026-08
Next-Gen Thermal Engineering: Liquid Cold Plate Design for AI High-Density Compute
2026-08-22
25
What Is a TEC Cooler? Principle, Benefits and Applications
20
Case Study: Aluminum Vapor Chamber (ALVC) Thermal Solution for Grid Control Box
2026-08-15