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Application
Aluminum Vapor Chamber(ALVC) Application
Liquid cooling plate(LCP) Application
Pulsating Heat Pipe (PHP) Application
3DVC Cooler Application
Copper Heat Pipes & Assemblies Application
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Air to air or liquid Heat exchanger Application
Roll Bond Plates Application
Capability
Folded fin heat sink capability
Cold forging and pin fin heat sink capability
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Stacked fin capability
Zipper fin capability
Skived fin capability
Extruded heat sink capability
Friction stir welding (FSW)capability
CNC precision machining capability
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30
2026-07
Aluminum Vapor Chamber (ALVC/FMHP): The Ideal Lightweight Thermal Solution for Modern High-Power Industrial Design
ALVC Vapor Chamber Cooling: Advanced Thermal Design for Home Energy Storage & Solar Generators
2026-07-25
28
23
Aluminum Vapor Chamber (ALVC) vs. Copper Heat Pipe: Which Thermal Solution Is Better for High-Power Electronics?
2026-07-18
21
Flat Array Microchannel Cold Plates: Ultimate High-Density Thermal Solution for Power Electronics
16
Thermal Limits of Traditional IGBT Skived Heat Sinks and PHP Technology Optimization
2026-07-11
14
Thermal Simulation: The Foundation of Modern Electronic Thermal Design
09
Industry Insight: Why Traditional Air Cooling Fails for High-Density Side-by-Side IGBT Layouts
2026-07-04
07
BESS Liquid Cooling Plates: The Cornerstone of Safe, Long-Lasting Energy Storage
02
Engineering Excellence: Precision Active Cooling for High-Power Compact Electronic Enclosures
2026-06-27
2026-06
Why Thermal Uniformity Matters More Than Cooling Power in BESS