3DVC Cooler
Product description
3DVC (3D Vapor Chamber) Cooler
| High-Performance Heat Dissipation Solution
Our 3DVC (3D Vapor Chamber) Cooler, evolved from copper vapor chambers and copper heat pipes, features an integrated interconnection design: multiple copper heat pipe units form a seamless 3D vacuum cavity, with cooling fins precisely welded for maximum heat transfer efficiency.
With over 2000W heat dissipation capacity, it outperforms traditional copper heat pipe heat sinks and water cooling solutions—offering faster heat conduction, lower thermal resistance, higher cost-effectiveness, and flexible space utilization. Fully customizable to customers’ mechanical configurations, it’s ideal for high-heat scenarios.
As HPC, AI equipment and Intel Eagle Stream platform-driven devices see rising power consumption, 3DVC has become one of the only two viable high-end cooling solutions. It’s widely applied in high-end servers, Netcom products (base stations, strong wave stations, data centers), and simplifies server design for better space efficiency.
Specifically engineered for high-power chips, it is fully compatible with NVIDIA GPUs (H100, H200), AMD CPUs, Intel CPUs, and other high-heat-flux chips, ensuring stable performance for cutting-edge AI and HPC systems.
3DVC Cooler Core Advantages
✓ Simple structure with excellent adaptability and easy installation, reducing deployment complexity for various scenarios.
✓ Compact size with a heat dissipation capacity of up to 2000W, ideal for space-constrained high-heat applications.
✓ High heat transfer efficiency: 3D structural phase change design ensures minimal thermal resistance and rapid heat conduction.
✓ Simplified medium circulation system with low total resistance, enhancing overall thermal performance.
✓ Pump-free design for higher operational reliability and significantly lower maintenance costs, reducing long-term operational expenses.
Why is 3DVC better?
Heatpipe
Heatpipes are excellent technology that transfer heat vertically.
Vapor Chamber
HVC is great at transferring heat horizontally on the hotspot.
3D Vapor Chamber
3DVC is better and more efficient because it combines four native heatpipes and Vapor Chamber into one solid unit to quickly absorb higher Thermal Design Power(TDP).
ALVC®Application
Intel Purley, Whitley, Eagle Stream platform
Servers, computer rooms
Netcom products, Base stations
High power heat elements, IGBTs
Data center
Windy and Solar
For more application details
NEWS
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WhatApp: +86 13534194131
Phone: +86 13534194131
E-mail : riken@alvcfactory.com
Factory Add: 3rd Industrial Zone, Tiantou Hengli Town, Dongguang City Guangdong Province China.
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Related Products
We focus on providing thermal management solutions and products with optimal performance and cost
High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.
Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.
Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.
The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.
Copper Heat Pipes & Assemblies
A copper heat pipe is a sealed enclosure maintained in a vacuum environment. It achieves two-phase cooling thermal transition through a continuous cycle of evaporation and condensation, ensuring efficient heat transfer for various thermal management scenarios.
Thermosyphon Cooler is a high-efficiency passive cooling system that achieves heat transfer entirely through natural convection, without the need for any mechanical pumps. This energy-saving and low-maintenance cooling solution enables the cooling medium to circulate independently and fully in a closed-loop system, ensuring stable and reliable heat dissipation performance for various industrial and commercial applications.
Air to air/ liquid Heat exchangers
Air-to-Air Heat Exchanger It transfers heat between two independent air streams via finned/plate core surfaces, with no air mixing required. Featuring simple structure and reliable performance, it is widely applied in HVAC, ventilation heat recovery and electronic air cooling systems. Air-to-Liquid Heat Exchanger This unit enables heat transfer between airflow and circulating liquid like water or glycol coolant. With high heat dissipation capacity and compact design, it is ideal for high-power electronics, IGBT thermal management, industrial equipment and server cooling applications.
The inside of the roll bond plate is in a vacuum state. The refrigerant as the working medium vaporizes at the heat source to absorb heat, and liquefies in the area outside the heat source to release heat。
FAQ
All products have passed ISO9001, CE, TUV, SGS certificates. We can support customers with quality inspections if needed.
Q1: Can you provide a free sample?
A: We can provide 1-3 general model samples of the aluminum vapor chamber for free, but the shipping charge will be borne by the customer. Customized products require a sample fee.
Q2: If I want to design a radiator, what information do I need to provide?
A: We offer eight series of products, each requiring different information. Please leave us a message in the "Quote" section at the top of the page, and our professional sales team will provide you with detailed guidance.
Q3: It's my first time importing thermal products. Can you help me with that?
A: Sure! We will assist you in arranging the shipment and guide you through the process.
Q4: What are your delivery terms?
A: Our standard delivery term is Ex Works (EXW) from our manufacturing facility in Dongguan City, Guangdong Province. If you are importing goods for the first time, we can help you arrange DPU or DDP shipping terms.
Q5: What about the design and product prices?
A: We offer free cooling solution design. Our products are manufactured in China, and we will provide you with the most competitive pricing available.
Q6: What are your payment terms?
A: Our standard payment terms are T/T in advance, as our products are customized and not standard items.
Q7: Do you offer custom-made products?
A: Yes, we specialize in custom cooling solutions and radiators. Please provide us with 2D/3D drawings, relevant heat source information, and structural details, and we will design a unique cooling solution tailored to your project.
Q8: What is the design and delivery time?
A: The design process typically takes 3-5 days. Mass production and delivery usually take 4-6 weeks.
With the expertise and agility of industry leaders, we have the ability to drive innovation to influence our customers and partners.
Contact UsContact us
WeChat:+86 135 3419 4131
Office Add: Room 802A, Tower A, Block 3, Tian’an Cyber Park, Huangge Road, Longgang District, Shenzhen City, Guangdong Province China.
Factory Add: 3rd Industrial Zone, Tiantou Hengli Town, Dongguang City Guangdong Province China.
