Application
If you order your service from ALVC, it will be carefully implemented by ALVC's professional team at ALVC's facilities to match your customization
3DVC (3D Vapor Chamber) - Next-Generation High Heat Dissipation Solution for Data Centers & Servers
Our 3DVC (3D Vapor Chamber) is a high-efficiency heat dissipation solution for data centers and high-performance servers. Integrated with Loop Heat Pipe (LHP) technology, it delivers 2000W maximum heat dissipation and seamless compatibility with Intel EGS/BHS, AMD SP5/SP7, and NVIDIA H100/H200, optimized for Google SEO and AI/HPC demands.
What Makes Our 3DVC Unique?
Our 3DVC’s core strength lies in integrated LHP technology, eliminating contact thermal resistance. Its closed-loop phase change cycle transfers heat 10x faster than pure copper, preventing hardware throttling and extending lifespan.
Key Advantages:
Superior Heat Transfer: Seamless LHP integration ensures uniform heat distribution, no hotspots.
2000W Capacity: Exceeds conventional solutions, ideal for AI servers and high-end GPUs.
Exceptional Uniformity: ≤2℃ surface temperature difference, protecting components.
Compact Design: 30% smaller, 25% lighter, suitable for dense data center deployment.
Broad Compatibility: Tailored for Intel, AMD, and NVIDIA high-performance platforms.
Ideal for data centers, AI servers and HPC systems, our 3DVC is a future-proof solution, combining LHP technology, 2000W capacity and SEO optimization to deliver reliable, efficient thermal management.
With the expertise and agility of industry leaders, we have the ability to drive innovation to influence our customers and partners.
Contact UsContact us
WeChat:+86 135 3419 4131
Office Add: Room 802A, Tower A, Block 3, Tian’an Cyber Park, Huangge Road, Longgang District, Shenzhen City, Guangdong Province China.
Factory Add: 3rd Industrial Zone, Tiantou Hengli Town, Dongguang City Guangdong Province China.
