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ALVC Fanless Thermal Solution PC Chassis and Application Showcase

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2026-04-14

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🚀 ALVC Fanless Thermal Solution PC Chassis and Application Showcase

Discover our high-performance fanless cooling chassis—engineered for unbeatable thermal management in high-power electronic systems.

Powered by ALVC's advanced thermal material boasting an ultra-high thermal conductivity of 5,000 W/m•K, this chassis efficiently transfers and dissipates intense heat from CPUs and GPUs directly to the enclosure. Its optimized extended fin structure maximizes heat dissipation surface area, delivering consistent, reliable cooling performance without the need for fans.

Key words：

Aluminum Vapor Chamber

cooling

Advantages of Thermosyphon Cooler

Extrusion Liquid Cooling Plate: High-Efficiency Thermal Solution for Your High-Power Systems

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

Copper Heat Pipes & Assemblies

A copper heat pipe is a sealed enclosure maintained in a vacuum environment. It achieves two-phase cooling thermal transition through a continuous cycle of evaporation and condensation, ensuring efficient heat transfer for various thermal management scenarios.

Thermosyphon Cooler

Thermosyphon Cooler is a high-efficiency passive cooling system that achieves heat transfer entirely through natural convection, without the need for any mechanical pumps. This energy-saving and low-maintenance cooling solution enables the cooling medium to circulate independently and fully in a closed-loop system, ensuring stable and reliable heat dissipation performance for various industrial and commercial applications.

Air to air/ liquid Heat exchangers

Air-to-Air Heat Exchanger It transfers heat between two independent air streams via finned/plate core surfaces, with no air mixing required. Featuring simple structure and reliable performance, it is widely applied in HVAC, ventilation heat recovery and electronic air cooling systems. Air-to-Liquid Heat Exchanger This unit enables heat transfer between airflow and circulating liquid like water or glycol coolant. With high heat dissipation capacity and compact design, it is ideal for high-power electronics, IGBT thermal management, industrial equipment and server cooling applications.

Roll Bond Plates

The inside of the roll bond plate is in a vacuum state. The refrigerant as the working medium vaporizes at the heat source to absorb heat, and liquefies in the area outside the heat source to release heat。

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NEWS

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Thermal Simulation: Why It Matters Before You Cut a Single Prototype

AI Cooling: Why Thermal Management Is Becoming a Critical Challenge for AI Data Centers

What is PHP/OHP (Pulsating/Oscillating Heat Pipe)? Principle, Benefits and Applications

Aluminum Vapor Chamber (ALVC): Lightweight Two-Phase Cooling for High-Power Thermal Management

Cold Plate Basics: What Design Factors Dominate Liquid-Cooled Cold Plate Performance for AI & Energy Storage Systems

Next-Gen Thermal Engineering: Liquid Cold Plate Design for AI High-Density Compute

WhatApp: +86 13534194131

Phone: +86 13534194131

E-mail : riken@alvcfactory.com

Factory Add: 3rd Industrial Zone, Tiantou Hengli Town, Dongguang City Guangdong Province China.

With the expertise and agility of industry leaders, we have the ability to drive innovation to influence our customers and partners.

WhatApp: +86 135 3419 4131

WeChat:+86 135 3419 4131

Phone: +86 135 3419 4131

E-mail : riken@alvcfactory.com

Office Add: Room 802A, Tower A, Block 3, Tian’an Cyber Park, Huangge Road, Longgang District, Shenzhen City, Guangdong Province China.

Factory Add: 3rd Industrial Zone, Tiantou Hengli Town, Dongguang City Guangdong Province China.

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