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Pipe Cold plates with embedded tubes process of Liquid cooling plate

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2024-03-20

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Pipe Cold plates with embedded tubes process of Liquid cooling plate

The Cold plates with embedded tubes process is the most commonly used manufacturing process for liquid cooling plates. Generally speaking, copper tubes are buried in an aluminum substrate. That is, the aluminum substrate is machined and milled with slots, and then a stamping machine is used to bend the copper tube into a good shape. It is pressed onto the aluminum substrate, then brazed and welded, and then post-processed into a water-cooled plate.

Liquid cooling plate

There are generally three forms of Cold plates with embedded tubes Liquid cooling plates: one is shallow Cold plates with embedded tubes Liquid cooling plate; the other is deeply Cold plates with embedded tubes Liquid cooling plate; the third is welded pipe process; the fourth is double-sided pipe clamping process Liquid cooling plate. There is little difference in the three forms of craftsmanship, and the difficulty of processing is also the same. Some liquid cooling principles originally designed for high-power switching devices can also be used for reference in power battery cooling systems.

Shallow Cold plates with embedded tubes process: suitable for single-sided installation. After the copper pipe is flattened and milled at the same time as the aluminum plate, it is fully conducive to the high thermal conductivity of the copper pipe to take away heat, and the lightweight of aluminum is used to reduce weight and control costs.

Deep Cold plates with embedded tubes process: The filler is high thermal conductivity epoxy resin imported from the United States. When the temperature difference of the cooled device is not high, it can be installed on both sides. Due to the thickness of the copper pipe, no secondary processing is required, and there is filler protection available for application. Safety, especially suitable for use on cold plates where refrigerant is the medium.

Welded pipe process: suitable for copper plate + copper pipe method, which can reduce the thickness of the plate and achieve weight reduction.

Key words：

Analysis of heat dissipation performance of parallel flow channel liquid cooling plate

Core requirements for liquid cooling plate technical quality

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.