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Thermosiphon: no power required, unique heat transfer method

Time：

2024-02-28

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Thermosiphon: no power required, unique heat transfer method

Thermosiphon is a heat transfer system based on the principle of natural convection. Its unique feature is that it does not require external power and only relies on temperature differences and gravity to transfer heat. This simple and effective heat transfer method is widely used in many industrial and daily fields. The following discusses the working principle and advantages of Thermosiphon:

Thermosiphon

working principle:

Thermosiphon systems usually consist of a heat source, a cold source and a heat pipe connecting the two. When the heat source generates heat, the liquid in the heat pipe is heated and expands, reducing its density and forming a convection cycle. The thermally expanded liquid rises from the heat source to the height of the heat pipe. After reaching the cold source, it is cooled and contracted. The density increases and decreases, forming a backflow. In this way, heat transfer is achieved without the involvement of external power.

Wide range of applications:

Thermosiphon systems have been widely used in many fields such as solar water heaters, air conditioning systems, and oil cooling systems. For example, in solar water heaters, the Thermosiphon system can use solar energy to heat water in the water tank to achieve natural circulation heating, which is energy-saving and environmentally friendly. In the oil cooling system, Thermosiphon can help the oil dissipate heat through heat pipes to maintain stable operation of the equipment.

Simple and efficient:

Since the Thermosiphon system has no mechanical parts, it has low maintenance costs, is stable and reliable, and can achieve high heat transfer efficiency. Its simple working principle and the fact that it does not rely on external energy give it unique advantages in some specific environments and has become one of the important technologies in the field of heat transfer.

Key words：

heat pipe

The development history of Thermosiphon

The development history of Liquid cooling plates

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High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.