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How to choose and buy a suitable IGBT cold plate

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2024-05-24

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How to choose and buy a suitable IGBT cold plate

In the field of power electronic devices, IGBT cold plate is a key heat dissipation component. Choosing the right product is crucial to system performance. This article will introduce some methods of selecting and purchasing IGBT cold plates to help you find the right product.

IGBT cold plate

First of all, understanding the system requirements is the first step in selecting IGBT cold plate. Different power electronic systems have different power and heat dissipation requirements, so it is necessary to select an appropriate IGBT cold plate according to the power, working environment and heat dissipation requirements of the specific system. Make sure the cold plate you choose can meet the cooling needs of the system.

Secondly, consider the heat dissipation performance and material. High-quality IGBT cold plates are usually made of aluminum alloy or copper with good thermal conductivity and have good heat dissipation effect. When choosing, you can refer to the heat dissipation performance indicators provided by the manufacturer and choose the appropriate material and design to ensure the heat dissipation effect.

IGBT cold plate

Furthermore, choose regular suppliers and brands. There are various brands and models of IGBT cold plates on the market. It is recommended to choose suppliers and brands with high visibility and good reputation to ensure product quality and after-sales service.

At the same time, pay attention to the size and installation method of the IGBT cold plate. Make sure the chosen cold plate size adapts to the design of the system so that it can be installed correctly and dissipate heat effectively. In addition, consider the installation method of the cold plate (such as air cooling, water cooling, etc.) and choose the appropriate installation method according to actual needs.

Finally, focus on price and value for money. When choosing IGBT cold plate, in addition to paying attention to product quality, you also need to consider price and cost performance. It is recommended to comprehensively consider factors such as product quality, performance and price, and choose products with high cost performance.

Key words：

Flat micro heat pipe arrays: subverting traditional heat dissipation methods

IGBT cold plate: the key to heat dissipation of power electronic devices

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

Copper Heat Pipes & Assemblies