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IGBT cold plate: the key to heat dissipation of power electronic devices

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2024-05-22

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IGBT cold plate: the key to heat dissipation of power electronic devices

IGBT cold plate is a vital part of power electronic devices, and its heat dissipation performance directly affects the working efficiency and stability of the entire system. This article will focus on the role of IGBT cold plate and its importance in power electronic devices.

IGBT cold plate

First of all, the function of IGBT cold plate is to dissipate heat. During the operation of power electronic devices, a large amount of heat will be generated. If the heat dissipation is not timely and effective, it will cause the temperature of the device to rise, thus affecting its performance and life. The IGBT cold plate conducts the heat generated by the device to the outside through thermal conduction to achieve heat dissipation and keep the device operating within a reliable temperature range.

Secondly, the thermal conductivity of IGBT cold plate has a direct impact on system performance. Excellent thermal conductivity can make heat dissipation faster and more efficient, ensuring that the device will not overheat when working under high load for a long time, maintaining the stability and reliability of the system. The IGBT cold plate with poor thermal conductivity can easily cause the device temperature to be too high or even malfunction.

IGBT cold plate

Furthermore, the material selection of IGBT cold plate is also crucial. High-quality heat dissipation materials, such as aluminum alloy or copper, not only have good thermal conductivity, but also have high corrosion resistance and mechanical strength, and can better adapt to the heat dissipation needs in different working environments.

Finally, regular inspection and maintenance are also crucial to ensure the heat dissipation effect of IGBT cold plate. Timely cleaning, removal of blockages, and checking for damage or aging can effectively extend the service life of the IGBT cold plate and ensure the normal operation of the entire power electronic system.

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How to choose and buy a suitable IGBT cold plate

What is the principle of Water cooling plate

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

Copper Heat Pipes & Assemblies