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Performance requirements of Liquid Cold plate

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2024-09-11

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Performance requirements of Liquid Cold plate

As an important heat dissipation device, Liquid Cold plate is widely used in many fields, such as electronic equipment, electric vehicles, etc. The quality of its performance directly affects the stable operation and efficiency of related systems. The following are some key performance requirements of Liquid Cold plate.

Liquid Cold plate

1. Efficient heat dissipation performance

This is one of the most core requirements of Liquid Cold plate. It needs to be able to quickly transfer heat from the heat source to the coolant and take away the heat through the circulation of the coolant. Good thermal conductivity and a large heat dissipation area are key factors in achieving efficient heat dissipation.

2. Good sealing performance

Liquid Cold plate must have reliable sealing to prevent leakage of coolant. Any leakage will not only affect the heat dissipation effect, but may also cause damage to the equipment and even cause safety problems. High-quality sealing materials and precise processing technology are important guarantees to ensure sealing performance.

3. High strength and durability

During use, Liquid Cold plate may be subjected to certain pressure and vibration. Therefore, it needs to have sufficient strength to resist these external forces, and at the same time have good durability to maintain stable performance in long-term use.

4. Smaller flow resistance

The flow of coolant in the Liquid Cold plate should be as smooth as possible to reduce the flow resistance. Lower flow resistance helps reduce the power consumption of the pump and improve the efficiency of the entire cooling system.

5. Corrosion resistance

Due to long-term contact with coolant, the Liquid Cold plate must have good corrosion resistance to prevent damage by coolant erosion. Selecting suitable materials and performing appropriate surface treatment can enhance its corrosion resistance.

6. Compact structural design

In some application scenarios, space is limited, and the Liquid Cold plate needs to have a compact structural design to adapt to different installation environments without affecting its heat dissipation performance.

7. Temperature uniformity

Ensure that the temperature of the heat source can be evenly distributed on the Liquid Cold plate to avoid local overheating or overcooling, which can better protect the equipment and improve the heat dissipation efficiency.

8. Maintainability

It is easy to install, disassemble and maintain. When there is a problem with the Liquid Cold plate, it can be repaired or replaced in time to reduce the impact on the operation of the system.

In short, the performance requirements of Liquid Cold Plate are multifaceted. Only when these aspects reach a high level can we meet the needs of different application scenarios and provide reliable heat dissipation guarantee for the stable operation of related equipment.

Key words：

Liquid Cold Plate Heat Dissipation Performance Analysis

Detailed explanation of the design steps of Liquid Cold Plate

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

Copper Heat Pipes & Assemblies