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The role of surface treatment of Liquid Cold Plate in heat dissipation

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2025-05-23

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The role of surface treatment of Liquid Cold Plate in heat dissipation

As an efficient heat dissipation component, the surface treatment of Liquid Cold Plate plays an important role in the heat dissipation effect.

First, surface treatment can improve the thermal conductivity of Liquid Cold Plate. For example, by polishing the surface of Liquid Cold Plate, the surface roughness can be reduced, making the contact between Liquid Cold Plate and coolant closer. When the coolant flows on the surface of Liquid Cold Plate, the smoother surface can reduce the resistance to heat conduction and allow heat to be transferred from Liquid Cold Plate to coolant more quickly.

Liquid Cold Plate

Second, surface treatment helps prevent corrosion. Many Liquid Cold Plates are made of metal, such as copper or aluminum. In the process of long-term contact with the coolant, if there is no appropriate surface treatment, corrosion is likely to occur. Surface corrosion will form a corrosion layer, which has poor thermal conductivity and will greatly hinder the transfer of heat. Through surface treatment methods such as anodizing and electroplating, a protective film can be formed on the surface of the Liquid Cold Plate, which not only prevents corrosion but also ensures good heat dissipation performance.

In addition, surface treatment can also affect the wettability of the coolant. The specially treated surface can make the coolant spread better on the surface of the Liquid Cold Plate. When the coolant is evenly spread on the surface of the Liquid Cold Plate, the contact area between the coolant and the Liquid Cold Plate increases, thereby improving the heat exchange efficiency. For example, some surface coatings can reduce the surface tension of the coolant, allowing the coolant to quickly cover the entire surface of the Liquid Cold Plate, like a tightly fitting net, maximizing the capture of heat.

In addition, surface treatment can also improve the heat dissipation uniformity of the Liquid Cold Plate to a certain extent. Certain surface treatment technologies can adjust the microstructure of the Liquid Cold Plate surface, making the heat more evenly distributed on the Liquid Cold Plate surface, avoiding local overheating, and thus improving the stability and reliability of the entire cooling system.

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Design points of Liquid Cold plate cooling system

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

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