5G base station heat sink

5G base station thermal solution

 

 

By 2025, the communication industry will consume 20% of the world's electricity. In mobile communication networks, base stations are the largest power consumers, and about 80% of the energy consumption comes from widely distributed base stations. More dense base stations mean higher energy consumption, which is a major cost challenge for 5G networks. The power consumption of 5G base stations is 2.5 to 4 times that of 4G base stations. From the perspective of thermal design, the heat generated by the base station increases, and the difficulty of temperature control rises sharply.

The 5G base station belongs to a multi-chip shared chassis for heat dissipation, which reduces the volume and weight of the product. The demand for thermal design of this type of product has evolved to improve heat transfer efficiency and reduce heat transfer thermal resistance as much as possible in the same space. A more reasonable fin form needs to be designed to match the high power consumption material level of the base station, and materials with lighter weight and better thermal conductivity are required. Roll bond plate and aluminum vapor chambers (ALVC) feature high thermal conductivity and light weight. So our aluminum vapor chamber and roll bond plate is the best choice for the fins of the radiator.

Below is our design for 5G base station heat sink (the fin used ALVC or roll bond plate)