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Extruded Heat Sink Capability

Extruded heat sink (also known as heat sink extrusion or extruded aluminum heat sink) is renowned for its beautiful appearance, lightweight design, excellent heat dissipation performance, and energy-saving benefits. The extrusion process involves heating aluminum ingots to 520~540℃ and forcing the molten aluminum through a custom grooved mold, followed by cutting and finishing to form the final product.

AL6063 is our commonly used aluminum material, offering good thermal conductivity and machinability. Leveraging years of technical experience and optimized production processes, ALVC combines high-thermal-conductivity aluminum alloy profiles to develop customized extruded heat sinks, meeting customers' demands for differentiation, specialization, and personalization. The surface of our extruded heat sinks is anodized to enhance corrosion resistance, wear resistance, and aesthetics.

We cooperate with top aluminum extruders to ensure product quality. Extruded aluminum heat sinks are basic units in thermal management systems, and can be combined with high-thermal-conductivity materials such as heat pipes to solve more complex heat dissipation challenges. They are widely used in machinery, automobiles, wind power, construction machinery, air compressors, railway locomotives, household appliances, and other industries, with common types including electronic heat sinks, computer heat sinks, sunflower heat sinks, and power semiconductor heat sinks.

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Skived fin heat sink

Friction Stir Welding (FSW) Capability

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

Copper Heat Pipes & Assemblies

A copper heat pipe is a sealed enclosure maintained in a vacuum environment. It achieves two-phase cooling thermal transition through a continuous cycle of evaporation and condensation, ensuring efficient heat transfer for various thermal management scenarios.

Thermosyphon Cooler

Thermosyphon Cooler is a high-efficiency passive cooling system that achieves heat transfer entirely through natural convection, without the need for any mechanical pumps. This energy-saving and low-maintenance cooling solution enables the cooling medium to circulate independently and fully in a closed-loop system, ensuring stable and reliable heat dissipation performance for various industrial and commercial applications.

Air to air/ liquid Heat exchangers

Air-to-Air Heat Exchanger It transfers heat between two independent air streams via finned/plate core surfaces, with no air mixing required. Featuring simple structure and reliable performance, it is widely applied in HVAC, ventilation heat recovery and electronic air cooling systems. Air-to-Liquid Heat Exchanger This unit enables heat transfer between airflow and circulating liquid like water or glycol coolant. With high heat dissipation capacity and compact design, it is ideal for high-power electronics, IGBT thermal management, industrial equipment and server cooling applications.

Roll Bond Plates

The inside of the roll bond plate is in a vacuum state. The refrigerant as the working medium vaporizes at the heat source to absorb heat, and liquefies in the area outside the heat source to release heat。