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Cold Forging and Pin Fin Heat Sink Capability

Cold forging and pin fin heat sink is produced through a high-precision manufacturing process, where workpieces are formed under high pressure and low temperature. This process eliminates air bubbles, porosity, and other impurities in the material, ensuring exceptionally high product quality and reliability—critical for demanding thermal management scenarios.

Compared with traditional manufacturing methods (machining, die casting, extrusion, hot forging, etc.), our cold forging and pin fin heat sinks offer unparalleled advantages, especially in aluminum heat sink production: we can produce pins with an aspect ratio of 50:1 (height 50 times the diameter), a feat impossible with die-casting or extrusion.

Unlike stamped-fin or bonded-fin heat sinks, the pins of our forged heat sinks are an integral part of the base plate—squeezed directly from the base with no air gap or thermal interface. This design allows heat to transfer from the base to the pins seamlessly, without additional thermal resistance, maximizing cooling efficiency.

Cold Forging and Pin Fin Heat Sink Advantages

Incoming air stream from all directions for uniform cooling

Improved mechanical strength for long-term durability

Superior surface finish for better heat transfer and aesthetics

Precise tolerance control for perfect fit in assembly

Efficient raw material utilization to reduce waste

Reduced energy consumption for eco-friendly production

High production rate to meet large-order demands

Low overall cost for cost-effective thermal solutions

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Folded fin heat sink capability

Die Casting Heat Sink Capability

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

Copper Heat Pipes & Assemblies

A copper heat pipe is a sealed enclosure maintained in a vacuum environment. It achieves two-phase cooling thermal transition through a continuous cycle of evaporation and condensation, ensuring efficient heat transfer for various thermal management scenarios.

Thermosyphon Cooler

Thermosyphon Cooler is a high-efficiency passive cooling system that achieves heat transfer entirely through natural convection, without the need for any mechanical pumps. This energy-saving and low-maintenance cooling solution enables the cooling medium to circulate independently and fully in a closed-loop system, ensuring stable and reliable heat dissipation performance for various industrial and commercial applications.

Air to air/ liquid Heat exchangers

Air-to-Air Heat Exchanger It transfers heat between two independent air streams via finned/plate core surfaces, with no air mixing required. Featuring simple structure and reliable performance, it is widely applied in HVAC, ventilation heat recovery and electronic air cooling systems. Air-to-Liquid Heat Exchanger This unit enables heat transfer between airflow and circulating liquid like water or glycol coolant. With high heat dissipation capacity and compact design, it is ideal for high-power electronics, IGBT thermal management, industrial equipment and server cooling applications.

Roll Bond Plates

The inside of the roll bond plate is in a vacuum state. The refrigerant as the working medium vaporizes at the heat source to absorb heat, and liquefies in the area outside the heat source to release heat。