Customized Solutions for Liquid Cold Plate for High-Power Devices
Release time：
2025-08-27 16:00
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As electronic devices continue to advance toward higher power and higher integration, traditional air cooling methods are increasingly unable to meet heat dissipation requirements. This is particularly true in areas such as new energy vehicle batteries, power electronics modules, data center servers, and laser equipment, where high power density and high heat generation pose a core challenge. Liquid cold plates, due to their efficient heat transfer and stable temperature control, have become the preferred cooling solution for high-power devices. Customized design is crucial to meeting these complex requirements.
The structural design of customized liquid cold plates is crucial. High-power devices often have varying heat dissipation distributions, making it difficult to accommodate a single, standard liquid cold plate. Therefore, engineers design microchannels, serpentine flow paths, or double-sided cooling structures based on the layout of the device's power modules to achieve precise localized heat dissipation. Furthermore, by optimizing flow path length and liquid flow rate, flow resistance can be reduced while ensuring efficient heat dissipation, improving overall energy efficiency.
Material selection is also crucial for customized solutions. Common liquid cold plates are often made of aluminum alloy or copper. Aluminum alloy is lightweight and has excellent thermal conductivity, making it suitable for weight-sensitive applications. Copper, on the other hand, offers superior thermal conductivity and is well-suited for electronic modules with high heat flux densities. Some applications also utilize composite materials or nickel plating to improve corrosion resistance and service life.
The manufacturing process directly impacts the reliability of the Liquid Cold Plate. Depending on the design requirements, friction stir welding, vacuum brazing, or laser welding can be used to ensure the tightness of the internal flow channels and structural strength. For high-power devices, welding quality not only affects heat dissipation performance but also determines the safety of the Liquid Cold Plate in high-pressure coolant circulation.
System-level matching design is also crucial. The Liquid Cold Plate must be used in conjunction with pumps, coolant lines, radiators, and other components. Customized solutions often involve more than just optimizing a single Liquid Cold Plate; they involve the coordinated design of the entire liquid cooling system to achieve optimal temperature control.
Customized solutions for Liquid Cold Plates in high-power devices require comprehensive consideration of multiple aspects, including structural design, material selection, manufacturing process, and system matching. Scientific customization and optimization can not only effectively reduce equipment temperature rise and extend service life, but also improve energy efficiency, providing a strong guarantee for safe, efficient, and sustainable operations.
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