Thermosyphon Cooler
Thermosyphon Cooler
Thermosyphon Cooler
Thermosyphon Cooler
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  • Thermosyphon Cooler
  • Thermosyphon Cooler
  • Thermosyphon Cooler
  • Thermosyphon Cooler

Thermosyphon Cooler

Thermosyphon Cooler is a high-efficiency passive cooling system that achieves heat transfer entirely through natural convection, without the need for any mechanical pumps. This energy-saving and low-maintenance cooling solution enables the cooling medium to circulate independently and fully in a closed-loop system, ensuring stable and reliable heat dissipation performance for various industrial and commercial applications.

Product description


Thermosyphon Cooler | High-Efficiency Passive Heat Transfer Solution

A thermosyphon (or thermosyphon cooler) is an advanced passive heat exchange technology that relies on natural convection to circulate fluid—eliminating the need for mechanical pumps. This energy-efficient, low-maintenance thermosyphon cooler solution is widely used in industrial, electronic, and data center applications, delivering reliable heat transfer performance while reducing operational costs.

Thermosyphon Cooler: Core Structure & Working Principle 
The loop thermosyphon cooling heat sink features a closed-loop design consisting of four key components, working together to enable efficient passive heat transfer for the thermosyphon cooler: 
• Evaporator: Equipped with a boiling enhancement structure, the evaporator efficiently absorbs heat from the heat source, causing the internal liquid to boil and vaporize—critical for the thermosyphon cooler’s performance. 
• Rising Tube (Riser): Connects the evaporator to the condenser, facilitating the upward flow of vaporized fluid with minimal resistance to support the thermosyphon cooler’s circulation. 
• Condenser: Cools the vaporized fluid, converting it back into a liquid state and releasing the absorbed heat into the surrounding environment, a key step in the thermosyphon cooler’s heat transfer process. 
• Falling Tube (Downcomer): Guides the condensed liquid back to the evaporator using gravity, completing the closed-loop circulation and enabling continuous heat transfer for the thermosyphon cooler.


As a passive heat transfer device, the thermosyphon (thermosyphon cooler) relies solely on gravity for liquid return and phase change (vaporization and condensation) for heat transfer—no mechanical pumps required. It can be designed as a single tube or a closed loop, with loop thermosyphon technology excelling in long-distance and high-power heat transfer, as well as supporting multiple heat sources in one loop for the thermosyphon cooler. 
 

Exceptional Thermal Conductivity of Thermosyphon Cooler 
The equivalent thermal conductivity of a thermosyphon (thermosyphon cooler) is 50~100 times that of pure aluminum, with a thermal conductivity range of 8,000~35,000 W/m.K. Its performance is further enhanced under specific high-power conditions, making the thermosyphon cooler ideal for high-heat-flux applications.

Thermosyphon Cooler vs. Traditional Cooling Solutions 
1. Thermosyphon Cooler vs. Heat Pipes & Vapor Chambers (Uniform Temperature Version) 
Compared to heat pipes and vapor chambers, the loop thermosyphon (thermosyphon cooler) offers distinct advantages in long-distance heat transfer, high power, and high power density. Through professional design, the thermosyphon cooler can serially connect multiple heating elements in a single loop. While heat pipes and vapor chambers typically support a power density of 10~50W/cm², the loop thermosyphon cooler’s evaporator can easily handle 30~80W/cm²—even up to 100W/cm²—making it superior for high-power, long-distance heat transfer scenarios. 


2. Thermosyphon Cooler vs. Water-Cooling Systems 
Unlike water-cooling systems, the loop thermosyphon cooler operates on physical principles with a simple structure. It achieves self-circulation through fluid phase change pressure and density differences, eliminating the need for mechanical pumps. This avoids pump maintenance and replacement, improves the thermosyphon cooler’s reliability, and reduces operational costs. Note: The thermosyphon cooler’s stable operation relies on gravity-assisted fluid circulation, requiring a specific angle range. Therefore, the thermosyphon cooler’s working angle must be discussed with the customer during the initial project development phase. 


3. Thermosyphon Cooler vs. Traditional 2-Phase Flow Heat Transfer Devices 
Compared to traditional 2-phase flow devices (heat pipes and vapor chambers), the loop thermosyphon cooler is more efficient. Unlike these devices—where liquid and gas flow against each other in the same pipe—the loop thermosyphon cooler separates liquid and gas flow, resulting in a much higher maximum heat transfer amount (Qmax) and lower thermal resistance. 
Thermosyphon Cooler Applications: Addressing Modern Cooling Demands 
 

Electronic Chip Cooling with Thermosyphon Cooler 
The trend toward small packaging and high power in chipsets has created a demand for reliable, high-efficiency cooling solutions. Traditional methods like conduction and forced convection are insufficient for high heat fluxes, while the thermosyphon cooler emerges as an optimal choice for meeting these cooling needs. 
 

Data Center Cooling with Thermosyphon Cooler 
With the rapid development of artificial intelligence (AI), big data, and cloud computing, data centers are expanding globally. While conventional data center cooling systems are safe and reliable, they consume significant energy. The loop thermosyphon cooler offers low energy consumption, high heat flux dissipation, and minimal temperature differences—making it one of the most promising cooling solutions for modern data centers.

Advantage

 

 ​​    Remote cooling loop-based technology

 ​​    Capable for outdoor use

 ​​    Power ranges typically 150~3,000 W/Evaporator

 ​​    Capable to move heat meters away without a mechanical pump and moving parts 

 ​​    Handles multi-heat sources 

 ​​    High efficient condenser with optimized fin pitch

 ​​    No pump design, higher reliability and low maintenance cost

 

Working Mechanism

Product legend

Key Application Categories

 

 

ShenzhenWanwei Heat Conduction Technology Co., Ltd 
Electronic DevicesHigh-performance computing (HPC) chips, CPUs, GPUs, FPGAs, and high-power chipsets. It solves the high heat flux cooling needs brought by chip miniaturization and high power, ensuring stable device performance.

 

ShenzhenWanwei Heat Conduction Technology Co., Ltd 
Data CentersData center cooling units, server cooling systems, and cabinet cooling equipment. It serves as an energy-efficient free cooling solution, reducing PUE and energy consumption, and supports long-distance and multi-heat source heat dissipation.

 

 

ShenzhenWanwei Heat Conduction Technology Co., Ltd 
Telecommunications5G base stations, remote radio units (RRUs), MIMO radios, and telecom base station cabinets. It adapts to the heat dissipation needs of outdoor telecom equipment with low maintenance and remote heat transfer capabilities.

 

 

ShenzhenWanwei Heat Conduction Technology Co., Ltd 
Energy Storage & New EnergyEnergy storage converters (PCS) inductor cooling systems, battery energy storage systems (BESS), solar water heaters, and ground-source heat pumps. It provides efficient heat dissipation for energy storage modules and improves energy utilization.

 

ShenzhenWanwei Heat Conduction Technology Co., Ltd 
Industrial ProductionIndustrial cabinets, inverters, motor drives, railway signal cabinets, chemical reactors, transformers, and generators. It adapts to high-power and harsh environment cooling needs, extending equipment service life.

 

ShenzhenWanwei Heat Conduction Technology Co., Ltd 
Other Special ApplicationsOutdoor industrial enclosure cooling equipment and waste heat recovery devices. It is used for heat dissipation of outdoor industrial control equipment and waste heat recovery in industries such as steel and chemical engineering.

For more application details    


We focus on providing thermal management solutions and products with optimal performance and cost

Aluminum vapor chamber

High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT & power electronics and energy storage systems. Features: ultra-thin profile, high thermal conductivity, customizable size and shape.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipe (PHP, or Oscillating Heat Pipe) is advanced thermal management tech for high-power electronics, delivering high-efficiency, reliable heat sinks for aerospace, satellites, military equipment and VPX cooling chassis. Different from conventional heat pipes, PHP adopts a simple closed capillary loop charged with working fluid. Driven by fluid phase change, internal oscillation transfers heat rapidly with low flow resistance, requiring no pumps or moving components. Our optimized PHP heat sinks fit compact, mission-critical systems. Lightweight and miniaturized, they run stably and prolong device service life under extreme conditions such as microgravity and severe military environments. Core merits include outstanding heat conductivity, quick thermal response, robust environmental adaptability, low upkeep and broad operating temperature range.

Liquid Cooling Plate (LCP)

Liquid cold plates capture heat through the contact surface and remove heat via precision-engineered internal flow channels. Equipped with dedicated inlet and outlet ports, the liquid cold plate connects to external coolant pumps and cooling loop systems through tubing. The cooling liquid circulates continuously within the internal channel structure, rapidly and efficiently transferring heat away from heat sources.Our liquid cold plates are widely adopted for thermal management and heat dissipation in BESS energy storage systems, EV battery packs, high-power IGBT modules, industrial CPUs, GPUs and other high-power heat-generating equipment.

3DVC Cooler

The 3DVC cooler is developed based on conventional copper vapor chambers and copper heat pipes. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual heat pipe units.

Copper Heat Pipes & Assemblies

A copper heat pipe is a sealed enclosure maintained in a vacuum environment. It achieves two-phase cooling thermal transition through a continuous cycle of evaporation and condensation, ensuring efficient heat transfer for various thermal management scenarios.

Thermosyphon Cooler

Thermosyphon Cooler is a high-efficiency passive cooling system that achieves heat transfer entirely through natural convection, without the need for any mechanical pumps. This energy-saving and low-maintenance cooling solution enables the cooling medium to circulate independently and fully in a closed-loop system, ensuring stable and reliable heat dissipation performance for various industrial and commercial applications.

Air to air/ liquid Heat exchangers

Air-to-Air Heat Exchanger It transfers heat between two independent air streams via finned/plate core surfaces, with no air mixing required. Featuring simple structure and reliable performance, it is widely applied in HVAC, ventilation heat recovery and electronic air cooling systems. Air-to-Liquid Heat Exchanger This unit enables heat transfer between airflow and circulating liquid like water or glycol coolant. With high heat dissipation capacity and compact design, it is ideal for high-power electronics, IGBT thermal management, industrial equipment and server cooling applications.

Roll Bond Plates

The inside of the roll bond plate is in a vacuum state. The refrigerant as the working medium vaporizes at the heat source to absorb heat, and liquefies in the area outside the heat source to release heat。


All products have passed ISO9001, CE, TUV, SGS certificates. We can support customers with quality inspections if needed.

Q1: Can you provide a free sample?


A: We can provide 1-3 general model samples of the aluminum vapor chamber for free, but the shipping charge will be borne by the customer. Customized products require a sample fee.

Q2: If I want to design a radiator, what information do I need to provide?


A: We offer eight series of products, each requiring different information. Please leave us a message in the "Quote" section at the top of the page, and our professional sales team will provide you with detailed guidance.

Q3: It's my first time importing thermal products. Can you help me with that?


A: Sure! We will assist you in arranging the shipment and guide you through the process.

Q4: What are your delivery terms?


A: Our standard delivery term is Ex Works (EXW) from our manufacturing facility in Dongguan City, Guangdong Province. If you are importing goods for the first time, we can help you arrange DPU or DDP shipping terms.

Q5: What about the design and product prices?


A: We offer free cooling solution design. Our products are manufactured in China, and we will provide you with the most competitive pricing available.

Q6: What are your payment terms?


A: Our standard payment terms are T/T in advance, as our products are customized and not standard items.

Q7: Do you offer custom-made products?


A: Yes, we specialize in custom cooling solutions and radiators. Please provide us with 2D/3D drawings, relevant heat source information, and structural details, and we will design a unique cooling solution tailored to your project.

Q8: What is the design and delivery time?


A: The design process typically takes 3-5 days. Mass production and delivery usually take 4-6 weeks.

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