AI Data Center Solutions
Data Center Solutions
Our unique 3D Loop VC Heat Sink Module is engineered for advanced thermal management of NVIDIA H100/H200 chips, solving critical heat challenges in high-performance data centers.
Based on an innovative loop heat pipe structure, it redefines dissipation efficiency for high-power chips. Unlike traditional solutions, its 3D design enables rapid, uniform heat transfer—capturing intense heat from H100/H200 chips (even under AI, big data, or HPC workloads) and maintaining optimal temperatures.
Leveraging this technology, the heat sink ensures stable chip performance, extends hardware lifespan, and meets modern data centers' evolving demands. It stands as a game-changing solution for next-generation chip thermal issues.
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Phone：+86 135 3419 4131
E-mail : riken@alvcfactory.com
ADD :Room 802A Tower A Block 3 Tian’an Cyber Park
Huangge Road Long Gang District Shen Zhen City Guang
Dong Province China.
3rd Industrial Zone Tiantou Hengli Town Dong Guang
City Guang Gong Province China.
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