3DVC heat sink assembly

3DVC heat sink assembly

 

 

ChatGPT leads the rapid development of artificial intelligence, and the power of AI chips is also increasing, The traditional copper tube radiator has reached its limit. The 3D VC cooling module we developed can solve the heat generated by chips above 800w. It is very suitable for Intel Purley, Whitley, Eagle Stream platform and AI chip Nervana NNP-I, Mobileye EyeQ, Movidius, Arria 10 FPGA, Loihi. NVIDIA  Volta, Turing, T4, Xavier, NVDLA; samsung Exynos 9825; Qualcomm AI100; AMD and so on.