Our Thermal Management Breakthrough: Aluminum Vapor Chamber (ALVC)
Release time：
2025-12-23 00:00
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Our Thermal Management Breakthrough: Aluminum Vapor Chamber (ALVC)
Proprietary Sealed Internal Design
Industry-Leading Performance
- Ultra-high thermal conductivity: Up to 10,000 W/mK for rapid heat transfer in high-heat-flux scenarios.
- Custom shaping flexibility: Bends into complex forms without losing thermal efficiency, fitting tight/irregular spaces seamlessly.
- Broad temperature tolerance: Operates reliably from -70°C to 200°C, ideal for harsh working environments.
Key Advantages Over Copper Heat Pipes
- 30% lighter: A game-changer for weight-sensitive applications like aerospace and portable electronics.
- Cost-effective for large-scale use: Lowers total cost of ownership (TCO) without compromising performance.
- Customizable working fluid: Tailored to match specific thermal requirements.
Wide-Ranging Applications
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Level Up Your Thermal Design with ALVC®
Level Up Your Thermal Design with ALVC®
Our Thermal Management Breakthrough: Aluminum Vapor Chamber (ALVC)
Our Thermal Management Breakthrough: Aluminum Vapor Chamber (ALVC)/Micro Multi-Channel Flat Heat Pipes/Flat Micro Heat Pipe Arrays
High-efficiency liquid cooling enabled by a microchannel cold plate.
High-efficiency liquid cooling enabled by a microchannel cold plate. This cold plate interfaces directly with external cooling equipment via its inlet and outlet ports, providing continuous, stable heat removal. Multiple microchannels ensure uniform temperature distribution; even if the flow is not working in individual channels, the remaining paths maintain consistent cooling performance. The combination with the microchannel structure supports rapid heat spreading, reduces temperature gradients, and effectively suppresses local hot spots. Multiple microchannel flow paths ensure smooth and predictable coolant movement, making the design suitable for high-power and high-density thermal loads. Ideal for power electronics, laser systems, RF modules, and other compact high-performance devices requiring efficient liquid cooling.
Gravity-Defying Thermal Tech: Pulsating Heat Pipe (PHP).
Gravity-Defying Thermal Tech: Pulsating Heat Pipe (PHP). Tired of bulky, pump-reliant cooling systems for high-heat applications? Look no further. ALVC’s PHP packs a microchannel structure and optimized working fluid —no external power, no moving parts, just passive, self-sustaining cooling. Here’s how it works: ✅ Heat hits the pipe → fluid vaporizes, building pressure to drive self-circulation. ✅ Vapor reaches the cold end → condenses back to liquid, repeat the cycle. ✅ Non-stop, high-efficiency cooling. Engineered for the toughest environments, this solution is a game-changer for aerospace, defense electronics (including VPX systems), and space-constrained, high-heat scenarios. When performance can’t afford to overheat—PHP delivers
Mastering Safe Machining for High-Magnesium Alloys: AL5052 & AL5083 Expertise Unlocked!
🛡️ Mastering Safe Machining for High-Magnesium Alloys: AL5052 & AL5083 Expertise Unlocked! Working with high-magnesium aluminum alloys (AL5052/AL5083) delivers exceptional strength-to-weight ratios—but their unique properties demand rigorous safety protocols (think chip ignition risks, hydrogen explosion hazards, and oxidative heat buildup). ✅ Fire suppression: Dedicated dry-powder extinguishers (no water—critical for magnesium reactions) + real-time heat monitoring. ✅ Chip management: Segregated, ventilated storage + automated chip evacuation to eliminate accumulation risks. ✅ Trained specialists: Certified operators with deep expertise in magnesium machining safety + compliance with global standards (ISO, OSHA). ✅ Process integrity: Customized workflows that balance precision, efficiency, and absolute safety—no compromises. Whether you need complex components, high-volume production, or precision parts for aerospace, automotive, or industrial applications—we’ve got the safety-focused capabilities to deliver AL5052/AL5083 machining excellence. Ready to partner with a team that prioritizes safety as much as performance? Let’s connect!
Liquid Cold Plate Flow Channel Design
Liquid Cold Plate Flow Channel Design: 3 Core Internal Structures For thermal management engineers & power electronics teams—here’s a quick breakdown of the most widely used heat exchange architectures: 1. Serpentine Flow Channel Low manufacturing complexity & easy to prototype; Delivers uniform coolant distribution across large plate areas; Ideal for low-to-medium heat flux applications (e.g., consumer electronics inverters); 2. Pin Fin Structure Maximizes turbulent flow & heat transfer surface area Outstanding high-heat-flux dissipation (perfect for EV battery packs/IGBT modules) Tradeoff: Slightly higher pressure drop vs. serpentine designs. 3. Bionic Structure (bio-inspired from natural systems like leaf veins) Balances heat exchange efficiency & low flow resistance Adapts to irregular heat source layouts for targeted cooling Emerging as a top choice for high-density power systems What’s your go-to flow channel design for extreme thermal scenarios? Drop your insights below—I’m eager to learn your project wins (or pain points)!
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Phone：+86 135 3419 4131
E-mail : riken@alvcfactory.com
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Huangge Road Long Gang District Shen Zhen City Guang
Dong Province China.
3rd Industrial Zone Tiantou Hengli Town Dong Guang
City Guang Gong Province China.
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